Phakamisa ukusetshenziswa kwesikhunta se-mycelium sesikhunta kuma-elekthronikhi esimeme
Abacwaningi baseJohannes Kepler University eLinz, e-Austria benze uhlobo olusha lwezinto zikagesi ezibolayo abazibiza ngeMycelioTronics. Futhi inamandla amakhulu okunciphisa i-e-waste ehlupha i-hardware yazo zonke izinhlobo.
Okusha Umqondo usekelwe ekutshaleni nasekucubunguleni izikhumba ezivela kukhunta njenge-biodegradable substrate material okogesi okuluhlaza.
futhi yinie njengamanje wonke amasekethe e-elekthronikhi, enziwe ngezinsimbi eziqhutshwayo, kufanele baphumule phezu kwesisekelo sokuvikela nesokupholisa esibizwa ngokuthi i-substrate. Cishe kuwo wonke ama-computer chips, le substrate yenziwe ngama-polymers epulasitiki angaphinde asetshenziswe, ngokuvamile kulahlwa ekupheleni kwempilo ewusizo kwe chip
Lokhu kunomthelela kumathani ayizigidi ezingama-50 we-e-waste ekhiqizwa unyaka ngamunye. Ukuzinza okuhle kakhulu kokushisa kanye nemvelo yokuvikela ugesi yenethiwekhi yesici yenza isikhumba se-mycelium sibe i-substrate ekwazi ukubola efaneleka kakhulu ye-electronic circuitry.
UMartin Kaltenbrunner waseJohannes Kepler University eLinz, eJalimane uthi: “I-substrate ngokwayo inzima kakhulu ukugaywa kabusha. “Futhi i-electronics kakhulu futhi iyinani eliphansi kakhulu, ngakho-ke uma unama-chips anenani elikhulu ngempela, ungase ufune ukuwasebenzisa kabusha. »
Abacwaningi bakhule futhi balungisa izikhumba ze-mycelium fungal njengenye into ebolayo engaboli.
"Isikhumba" sisekelwe kusikhunta esimila ngokwemvelo okhunini oluqinile olufile endaweni enesimo sezulu esipholile. Banokuqina okuphezulu kokushisa kanye nokuma okuguquguqukayo, okuvumela ukuthengiswa kwezingxenye ze-elekthronikhi futhi kusize ukwakhiwa kwamabhodi wezinzwa ze-elekthronikhi. Ngaphezu kwalokho, bangakwazi ukumelana nemijikelezo yokugoba engaphezu kuka-2000.
I-mycelium ingasetshenziswa ngisho nasemabhethri asetshenziswa kancane. Abacwaningi bathole ukuthi amabhethri e-mycelium anganika amandla amadivaysi ezinzwa azimele, okuhlanganisa imojuli ye-Bluetooth kanye nenzwa yokusondelana nokuswakama. Lesi isinyathelo esibalulekile sokusimama.
Kuthiwa isikhumba asikhulanga kwamanye amakhowe ahlolwe abacwaningi. Lapho bekhipha futhi omisa isikhumba, bathola ukuthi yayivumelana nezimo, i-insulator enhle, ikwazi ukumelana nezinga lokushisa elingaphezu kuka-200 °C futhi kwakucishe kube ukujiya kwephepha, izakhiwo ezinhle ze-substrate yesifunda.
Izikhumba zivumela ukusetshenziswa kwamasu ajwayelekile okucubungula ama-elekthronikhi, okuhlanganisa ukufakwa komhwamuko obonakalayo kanye nephethini ye-laser, ukuthola imikhondo ye-elekthronikhi ene-conductivity efika ku-9,75 ± 1,44 × 104 S cm-1. Izikhumba ze-Mycelium eziguquguqukayo, ezivumelanayo zimelana nemijikelezo eguquguqukayo engaphezu kuka-2000 futhi zingagotshwa izikhathi eziningi ngokunyuka okumaphakathi kwamandla. Sibonisa ukuthi amabhethri e-mycelium anamandla afika ku-~3,8 mAh cm-2 asetshenziselwa ukunika amandla amadivayisi ezinzwa ezizimele, okuhlanganisa imojula ye-Bluetooth kanye nenzwa ye-proximity kanye nomswakamo.
Uma igcinwe kude nomswakama kanye nemisebe ye-UV, isikhumba cishe singahlala amakhulu eminyaka ngakho-ke kungaba kuhle empilweni yensiza kagesi. Kubalulekile ukuqaphela lokho futhi ingabola emhlabathini cishe amasonto amabili, okwenza kube lula ukusebenzisa kabusha.
Mayelana nenqubo, kushiwo ukuthi amasekethe ahlanganisiwe (ama-IC) enza iningi lesamba sengqikithi yamabhodi esekethe aphrintiwe (ama-PCB), ngenxa yokuminyana kwezinsimbi ezisetshenziswayo, kodwa kunzima ukwenza izinguqulo ezingaboli.
Amabhodi esekethe aphrintiwe omakhalekhukhwini abavamile, isibonelo, akhiwe ngama-63% ngesisindo sezinsimbi, ama-24% ngesisindo se-ceramics kanye no-13% ngesisindo sama-polymer.
Ngokuphathelene nengxenye yokuklama, okulandelayo kushiwo:
(A) Isithombe sebhodi lenzwa elihlanganisa ibhethri le-mycelium elinamaseli amabili, imojuli ye-Bluetooth, kanye nenzwa ye-impedance enesakhiwo se-electrode ephakathi kwedijithali.
(B) Impendulo ye-impedance yenzwa incike kakhulu kumswakama ohlobene wemvelo.
(C) Umthamo olungisiwe kanye nokumelana nesakhiwo senzwa ye-interdigital njengomsebenzi wokuvama
(D) Vimba idayagramu yebhodi lenzwa ekhiqiza futhi idlulisela idatha ku-PC yangaphandle ngesikhathi sokuhlolwa okungenantambo.
(E) Umunwe osondela kwinzwa ukhiqiza izinguquko ezicacile kumthamo wenzwa.
(F) Impendulo yekhono lenzwa ekusondeleni okuphindaphindiwe kweminwe ku-(E)
(G) Ukumunca ipuleti lenzwa kubangela izinguquko zomswakama ezibonakala ngokucacile.
(H) Impendulo yekhono ekushintsheni komswakamo ku-(G)
(I) Ukubola kwe-Aerobic kwe-MycelioTronic PCB substrates kwenzeka phakathi namaviki ama-2 enhlabathini efaka umquba.
(J) Iphesenti elikhulu le-PCB substrate ebolayo eboniswe ku-(I) ilinganiswa ezinsukwini eziyi-11
umsebenzi oshicilelwe kumasekhethi adidiyelwe angaboli isekelwe ku-biomass nezinto zezitshalo, okuholela ekucushweni kwe-elekthronikhi okudlulayo ngokuphelele okuhlanganisa ama-elementi esekethe awonakele.
Abacwaningi bathole amafilimu ensimbi ahlangene esikhumbeni esivuniwe anobunzima obungaphezulu be-Rrms obungu-7,5 ± 1,8 μm ngokufakwa ngokomzimba ngesikhathi sokuhwamuka, okuvumela ukucutshungulwa kwangemuva kokujikeleza.
Kamuva, amafilimu anokuqhubeka okuphindaphindekayo atholakala ngokufaka i-400 nm yethusi njengesisindo sokuhambisa, ne-predeposition engu-3 nm ye-chromium ukuze kunamathele kangcono. Baphinde bathuthukise ukusebenza ngokufaka ungqimba oluwugqinsi luka-50 nm lwegolide phezu kongqimba lokuqala lwethusi.
Ngale ntuthuko yakamuva esekelwe kumakhowe, izikhumba ze-mycelium ezingaboli zingase zivele njengesigaba sezinto ezihlukile ezisimeme zekusasa eliluhlaza le-elekthronikhi futhi zinikeze umfutho owengeziwe kumabhethri asimeme nezinto zikagesi.
Okokugcina uma unentshisekelo yokwazi kabanzi ngakho, ungabheka imininingwane kufayela le- isixhumanisi esilandelayo.