Intel ibonisiwe Zimbalwa iintsuku ezidlulileyo imephu yakho yendlela kule minyaka mine izayo, apho ikhankanya loo nto yenza iichips ngokusekwe kwinqubo ye-7nm, 4nm kunye ne3nmUkongeza, ngo-2024 izokwazisa ngetekhnoloji entsha yokuvelisa i-chip "I0ntel 20A" (20 Angstroms), ekufuneka iyivumele ukuba ibambe kwaye iphinde ibukhokele.
Ngaloo nto I-Intel yaqhubeka ngokuhlasela ngokunyusa amanyathelo ayo Ukubamba abachasi kule minyaka mine izayo, oku emva kokubhengeza ihlobo ephelileyo ukuba ayizukuzenzela ii-chips zayo ze-7nm ngenxa yobunzima bokusebenza, kodwa loo nto yatshintsha, njengoko i-Intel ekugqibeleni ithathe izintso kwakhona kunye neenyanga ezichaphazelekayo (ukuphela unyaka iichips zokuqala kufuneka ziqale ukuhanjiswa kwikota yokuqala ye-2022).
Enyanisweni, I-Intel iqale yazisa ukuba iyakutshintsha inkqubo yokuqamba amagama kubuchwepheshe bokuvelisa i-chip. Ngoku iya kusebenzisa amagama amafutshane ukulungelelanisa nendlela i-TSMC kunye ne-Samsung yokuthengisa itekhnoloji ye-semiconductor, apho incinci ingcono.
Njengenxalenye yokungena kwayo kwimarike yemveliso, i-Intel ilahla amagama anje nge- "Intel 10nm Enhanced Super Fine" kwaye ngoku Kuyakhankanywa ukuba ibibiza iprosesa zayo ezinje nge "Intel 7".
Iiprosesa ezintsha ezenziwe yi-Intel kulindeleke ukuba zibe noxinano olunokuthelekiswa ne-TSMC kunye neenombolo ze-7nm zeSamsung kwaye ziya kuba zilungele ukuveliswa kwi-Q2022 5. Kubalulekile ukuba ukhumbule ukuba ii-OEMs ze-TSMC zaseTaiwan kunye ne-Samsung yaseMzantsi Korea bahambisa iimveliso ezikroliweyo ezi-XNUMXnm.
Imephu yendlela ye-Intel ichaza ngokweenkcukacha ixesha le-post-nanometric ebizwa ngokuba yi "Angström" eraNgokwendlela ye-Intel, izakuqala ukuvelisa "Intel 20A" (20 Angstroms) process node ngo-2024 kwaye, ekuqaleni kuka-2025, izakusebenza kumlandeli wayo, oko kukuthi, "Intel 18A" node.
Igama litshintshela ku "Intel 20A" endaweni ka "2nm" kubonakala ngathi kungenxa yokuba le khowudi iza kubandakanya utshintsho olukhulu lweetshipsi zeIntel. Ngapha koko, iminyaka inkampani isebenzisa i-FinFET transistors, kodwa kwi-Intel 20A, iya kutshintshela kwi-GAA (isango-macala onke) uyilo olubiza ngokuba yi "RibbonFET."
Uyilo lwe-GAA luvumela abenzi be-chipm ukuba babambe amajelo amaninzi ngaphezulu komnye nomnye, okwenza amandla akhoyo ngoku abe ngumcimbi othe nkqo kunye nokwandisa uxinano lwe-chip. I-Intel 20A iya kusekelwa kwi "PowerVias," indlela entsha yoyilo lwe-chip eya kubeka umbane emva kwe-chip.
Ekugqibeleni, yeeprosesa eyenziweyo ikhankanya oku kulandelayo:
- Intel 7: unikezela ukonyuka malunga ne-10-15% kwintsebenzo ye-watt nganye xa kuthelekiswa ne- "Intel 10nm SuperFin", enkosi ekusebenzeni kwe-FinFET transistors. "I-Intel 7" izakubakhona kwiimveliso ezinje ngeAlder Lake yomthengi kwi-2021 kunye neSapphire Rapids yeziko ledatha, ekulindeleke ukuba libe kwimveliso kwikota yokuqala ka-2022.
- Intel 4: isebenzisa i-EUV lithography ukuprinta amanqaku amancinci ngokukhanya okufutshane kakhulu kwamaza. Ngokunyuka okungange-20% kwintsebenzo nge-watt nganye, kunye nokuphuculwa kobuso bomphezulu, i-Intel 4 iya kuba ilungele ukuya kwimveliso kwisiqingatha sesibini se-2022 yeemveliso ezithunyelwe ngo-2023, kubandakanya neMeteor Lake yabathengi kunye neGranite Rapids ye iziko ledatha.
- Intel 3: Kuthatha ithuba lokuphuculwa kweFinFET entsha kunye nokonyuka kwe-EUV ukuhambisa malunga ne-18% yokunyuka kokusebenza kwewatt nganye kwi-Intel 4, kunye nokuphuculwa komhlaba okungaphezulu. I-Intel 3 iya kufumaneka kwiimveliso zenkampani kwisiqingatha sesibini se-2023.
- I-Intel 18A: Ngaphaya kwe-Intel 20A, i-Intel 18A sele ikhulile kwangoko ku-2025, kunye nophuculo olwenziwe kwiRibbonFET. I-Intel ikwasebenza ekwakheni indawo ephezulu yokuvula amanani (i-NA ephezulu) ye-EUV. Inkampani ibanga ukuba iyakwazi ukufumana imveliso yokuqala ephezulu yamanani okuvula imveliso ye-EUV.
I-Intel kulindeleke ukuba yenze iichips zeQualcomm, iAmazon, kunye nabanye kwixa elizayo.
Umthombo: https://www.intel.com